The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2002

Filed:

Nov. 16, 1998
Applicant:
Inventors:

Yoshiyuki Yoneda, Kawasaki, JP;

Ryuji Nomoto, Kawasaki, JP;

Toshiyuki Motooka, Kawasaki, JP;

Kazuto Tsuji, Kawasaki, JP;

Junichi Kasai, Kawasaki, JP;

Toshimi Kawahara, Kawasaki, JP;

Hideharu Sakoda, Kawasaki, JP;

Kenji Itasaka, Kagoshima, JP;

Terumi Kamifukumoto, Kagoshima, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/328 ;
U.S. Cl.
CPC ...
H01L 2/328 ;
Abstract

A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts.


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Yoneda, Yoshiyuki. (2002). Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame (U.S. Patent No. 6376921). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6376921

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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