The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2002
Filed:
Nov. 16, 1998
Applicant:
Inventors:
Yoshiyuki Yoneda, Kawasaki, JP;
Ryuji Nomoto, Kawasaki, JP;
Toshiyuki Motooka, Kawasaki, JP;
Kazuto Tsuji, Kawasaki, JP;
Junichi Kasai, Kawasaki, JP;
Toshimi Kawahara, Kawasaki, JP;
Hideharu Sakoda, Kawasaki, JP;
Kenji Itasaka, Kagoshima, JP;
Terumi Kamifukumoto, Kagoshima, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/328 ;
U.S. Cl.
CPC ...
H01L 2/328 ;
Abstract
A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts.