The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2002
Filed:
Jan. 24, 2001
Nae Hisano, Kashiwa, JP;
Hideo Miura, Koshigaya, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A resin encapsulated semiconductor package, which uses leads (lead frame), and enhances heat conducting properties and prevents breaking of lengths of bonding wire, reduction in service life of solder joints and crack of a resin while ensuring reliability on strength. A lead material uses a material containing as a main constituent material a composite alloy of Cu O and Cu, which has a thermal conductivity as high as that of copper alloys having been conventionally used, and which is sintered to have a small linear expansion coefficient as compared with such copper alloys.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile