The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2002
Filed:
Oct. 10, 2000
Belgacem Haba, Cupertino, CA (US);
Donald V. Perino, North Potomac, MD (US);
Sayeh Khalili, San Jose, CA (US);
Rambus Inc., Los Altos, CA (US);
Abstract
A semiconductor module having a first integrated circuit die having a planar surface. The first integrated circuit die has a first conductive pad disposed substantially on the planar surface and a redistributed conductive pad electrically connected to the first conductive pad. The redistributed conductive pad is disposed near a periphery of the planar surface. The semiconductor module has a second integrated circuit die stacked adjacent to the planar surface and offset from the periphery, such that a second conductive pad on the second integrated circuit die can be electrically connected to the redistributed conductive pad.