The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2002
Filed:
Sep. 16, 1998
Reinhard Welsch, Dresden, DE;
Claus Dietrich, Dresden, DE;
Thomas Huelsmann, München, DE;
Dietmar Runge, Grosserkmannsdorf, DE;
Karl Suss Dresden GmbH, Sacka, DE;
Abstract
The present invention provides an apparatus for the testing of semiconductor structures. The apparatus is provided with a chuck for holding a semiconductor wafer and with needle holders for contact needles, the chuck being provided with a fastening device for the semiconductor wafer and being movable for positioning, controlled using a positioning device, in relation to the contact needles. The object of the present invention is to detect faults, in good time and reliably, of non-serviceable or not fully serviceable chips before separation to avoid unnecessary work for separating and assembling defective chips. The object is attained in that the chuck has a receiving area exposing upwards a lower surface of the semiconductor wafer and a receiving plane therefor. The receiving plane is arranged above the needle carrier, and the contact needles point upwards in such a manner that they contact contact islands of the semiconductor chips on the downwardly directed upper surface of the semiconductor wafer.