The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2002

Filed:

Jun. 17, 1999
Applicant:
Inventors:

Takayuki Wakae, Kawasaki, JP;

Akira Tsujimura, Fujisawa, JP;

Yuichiro Hara, Fujisawa, JP;

Tadashi Kamimura, Kawasaki, JP;

Masaaki Beppu, Tokyo, JP;

Eiji Hirai, Tokyo, JP;

Seiki Mori, Tokyo, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 9/00 ; C25D 1/500 ;
U.S. Cl.
CPC ...
B32B 9/00 ; C25D 1/500 ;
Abstract

The present invention is applicable to composite particles for composite dispersion plating used for forming a self-lubricating composite dispersion coating and a method of plating using such composite particles as well as a plating (coating) using the same. The purpose of the invention is to obtain a composite particle for composite dispersion plating which is comprised of a particle with an excellent capability of reducing the friction and a low or very low specific gravity, and a method of plating using such composite particles. In this invention, each of the composite particles includes a friction-reducing mother or core particle ( ) encapsulated with shell particles ( ) comprised of the same components as a base metal of a composite dispersion plating bath ( ). This provides a composite particle for composite dispersion plating which is comprised of a particle with an excellent capability of reducing the friction and a low or very low specific gravity. As a result, the composite particles can form an eutectic system in a plating layer without addition of any surfactant.


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