The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6371135 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 16, 2002

Filed:

Jul. 02, 2001
Applicant:
Inventor:

Matthew S. Ryskoski, Kyle, TX (US);

Assignee:

Advanced Micro Devices, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B08B 6/00 ;
U.S. Cl.
CPC ...
B08B 6/00 ;
Abstract

A method is described for removing a particle from a surface of a semiconductor wafer. In general, the method involves positioning an electrically conductive surface near the particle to be removed. An electrical charge is created on the electrically conductive surface. A charged particle beam is formed, wherein the charged particle beam includes particles having an electrical charge opposite the electrical charge of the electrically conductive surface. The charged particle beam is directed at the particle to be removed. When struck by the charged particle beam, the particle to be removed absorbs a portion of the charged particles of the charged particle beam and acquires an electrical charge opposite the electrical charge of the electrically conductive surface. A force created between the opposed electrical charges of the particle to be removed and the electrically conductive surface causes the particle to be removed to move from the surface of the semiconductor wafer and toward the electrically conductive surface. Several embodiments of an apparatus for carrying out the method are described.


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