The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2002
Filed:
Mar. 06, 2000
Alan G. Wood, Boise, ID (US);
Salman Akram, Boise, ID (US);
Mike Hess, Kuna, ID (US);
David R. Hembree, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A method for aligning and bonding balls to substrates, such as semiconductor wafers, dice and packages, is provided. The method employs a ball retaining plate having a pattern of micromachined cavities and vacuum conduits for retaining the balls. In addition, a substrate alignment member attached to the ball retaining plate, aligns the substrate to the balls. Using the substrate alignment member, bonding sites on the substrate can be placed in physical contact with the balls which are held by vacuum on the ball retaining plate. Next, the ball alignment plate and substrate can be place in a furnace for reflowing and bonding the balls to the bonding sites. An apparatus for performing the method includes the ball retaining plate and the substrate alignment member. A system for performing the method includes a ball loader mechanism for loading balls onto the ball retaining plate, and a vacuum fixture for applying a vacuum to the ball retaining cavities.