The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2002
Filed:
Dec. 01, 1999
Timothy Lee Johnson, Tempe, AZ (US);
Joseph English, Tempe, AZ (US);
David Austin, Phoenix, AZ (US);
George F. Carney, Mesa, AZ (US);
Kandis Mae Knoblauch, Gilbert, AZ (US);
Douglas G. Mitchell, Tempe, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method of manufacturing a semiconductor component includes depositing a first electrically conductive layer ( ) over a substrate ( ), forming a patterned plating mask ( ) over the first electrically conductive layer, coupling a first plating electrode ( ) to the first electrically conductive layer without puncturing the plating mask, and plating a second electrically conductive layer onto portions of the first electrically conductive layer. A plating tool for the manufacturing method includes an inner weir ( ) located within an outer weir ( ), an elastic member ( ) over a rim ( ) of the outer weir, a pressure ring ( ) located over the rim of the outer weir and the elastic member, and a plurality of cathode contacts ( ) located between the pressure ring and the outer weir. The substrate is positioned between the elastic member and the pressure ring.