The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2002
Filed:
Aug. 14, 2000
Applicant:
Inventors:
Hirokazu Tohya, Tokyo, JP;
Shiro Yoshida, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/09 ;
U.S. Cl.
CPC ...
H01R 9/09 ;
Abstract
In order to reduce electromagnetic inductive interference due to power source current, in a multi-layer printed board on which a multiplicity of high-speed and high-frequency circuit elements are mounted, a multi-layer printed board has a construction such that on both upper and lower sides of a power source layer provided with power source wiring , are laminated ground layers via respective first insulating material layers , and on one or both of the upper and lower sides of these is laminated a signal layer provided with signal wiring, via a second insulating material layer