The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2002
Filed:
Apr. 26, 1999
VLSI Technology Inc., San Jose, CA (US);
Abstract
A method for cleaning bonding pads on a semiconductor device, as disclosed herein, includes treating the bonding pads with a CF and water vapor combination. In the process, the water vapor breaks up and the hydrogen from the water vapor couples to fluorine residue on the bonding pad surface creating a volatile HF vapor. In addition, fluorine from the CF exchanges with the titanium in the metallic polymer residue making the polymer more soluble for the organic strip operation which follows. Next, the resist is ashed and then an organic resist stripper is applied to the bonding pad area, thereby creating a clean bonding pad surface. Thereafter, a reliable bond wire connection can be made to the bonding pad.