The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2002
Filed:
Sep. 11, 2000
Chi Chuan Wu, Taichung, TW;
Abstract
With increasing density and improving performance as well as growing function variety of the circuits integrated in a semiconductor chip, the heat dissipating capability of an IC package must be effectively promoted. An IC package based on a simple structure while capable of achieving better heat dissipation is therefore suggested by the present invention. The present invention is applicable to the IC package in which at least a semiconductor unit is located on the same side of substrate as terminals (such as solder balls or cylindrical terminals) are. The basic structure of the IC package comprises an electronic apparatus and a heat dissipater. The electronic apparatus includes a carrier such as a substrate, at least a semiconductor unit such as a chip/die, and at least a cylindrical terminal. The semiconductor unit and the cylindrical terminal attaches in approximately the same direction to the carrier. The heat dissipater includes at least a through-hole for the cylindrical terminal to penetrate, thereby the heat dissipater may be close to the carrier, whereby the IC package provides better heat dissipation without need of larger or more complicated structure.