The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2002
Filed:
Feb. 29, 2000
Motorola, Inc., Schaumburg, IL (US);
Abstract
A system ( ) and method are used for predicting and controlling the temperature of a semiconductor wafer ( ) during a solder reflow process by controlling the operating profile of a solder reflow furnace ( ). The emissivity of the surface of the wafer ( ) is measured using an infrared device ( ) prior to the solder reflow process. Using the measured emissivity value of the wafer ( ), the peak temperature of the wafer ( ) is predicted, and the operating profile of the solder reflow furnace ( ) is adjusted accordingly to achieve a desired temperature profile of the wafer ( ). A process for reflowing solder on a semiconductor wafer calculates a predicted peak temperature of a semiconductor wafer ( ) and controls the actual temperature of the wafer ( ) during a solder reflow process by controlling the operating profile of a solder reflow furnace ( ).