The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2002

Filed:

Apr. 30, 1999
Applicant:
Inventor:

Paul Holzapfel, Chandler, AZ (US);

Assignee:

Speedfam-Ipec Corporation, Chandler, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 ; B23P 1/510 ; B23K 1/119 ;
U.S. Cl.
CPC ...
B24B 1/00 ; B23P 1/510 ; B23K 1/119 ;
Abstract

A method and apparatus for polishing and planarizing workpieces such as semiconductor wafers is presented. Conditioning rings, which are used to condition polishing pads used in the planarization or polishing of semiconductor wafers, are shown which utilize brazed diamond technology in association with a coating of a titanium nitride containing composition or a thin film diamond deposition in order to reduce the fracturing and loss of cutting elements bonded to the conditioning ring.


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