The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2002
Filed:
Apr. 13, 2000
Other;
Abstract
A strap-like layered resin film ( ) having the same width as a semiconductor chip ( ) is cut out from a layered resin film ( F) and pressurized while being heated to the temperature below the transition temperature of a resin ribbon ( ), to be bonded onto a predetermined region ( R) of a lead frame ( ). Subsequently, removing a cover ribbon ( ) of non-stickiness from the film ( ), the semiconductor chip ( ) is bonded to the predetermined region ( R) with the resin ribbon ( ) of stickiness heated to about the transition temperature, and further pressurized. With this structure, in bonding the lead frame and the semiconductor chip with the resin film as a bonding material, it is possible to prevent emergence of a void caused by sucking air and extending-off of the bonding material.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile