The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2002
Filed:
Jun. 23, 1999
Shinichi Nishiura, Fussa, JP;
Tooru Mochida, Higashiyamato, JP;
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Abstract
A wire bonding method in which first and second bonding points are connected by a wire comprising the steps of: connecting the wire that passes through a capillary to a first bonding point, raising the capillary and performing a reverse operation so as to move the capillary in the opposite direction from the second bonding point, raising and moving the capillary toward the second bonding point and then lowering the capillary slightly, raising the capillary and performing at least once another reverse operation so as to move the capillary in the opposite direction from the second bonding point, and raising and then moving the capillary toward the second bonding point and connecting the wire to the second bonding point; thus forming a stable wire loop that has a high shape retention strength.