The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2002
Filed:
Aug. 31, 1999
Applicant:
Inventors:
Vaiyapuri Venkateshwaran, Singapore, SG;
Ji Cheng Yang, Singapore, SG;
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A stacked multichip assemblage including a plurality of integrated circuit die directly attached to a substrate having pads corresponding to terminals on the die, and interconnections between the die, and also to external contacts. The stacked integrated circuit arrangement includes a first chip(s) having an array of bumped terminals positioned on the corresponding pads of the substrate, a larger integrated circuit chip having perimeter bump terminals located over the first chip, and the terminals directly bonded to corresponding pads on the substrate.