The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2002
Filed:
Sep. 01, 2000
John A. Trezza, Nashua, NH (US);
Gregory K. Duddoff, Amherst, NH (US);
Teraconnect, Inc., Nashua, NH (US);
Abstract
A method for integration of integrated circuit devices includes providing an array of first devices including dummy devices on a first chip; providing an array of contacts on a second chip; flip-chip bonding the first device to the contacts; filing the voids between the two interstitially of the first devices with an underfill; masking the first devices leaving exposed selected dummy devices; removing the dummy devices leaving an array of holes with contacts; providing a spaced array of second devices on a third chip matching the array of holes; flip-chip bonding the second devices to the contacts in the holes; and filling the voids between the chips associated with second devices with an underfill.