The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2002

Filed:

Mar. 29, 2001
Applicant:
Inventor:

Ping-Yi Chang, Kaohsiung Hsien, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 4/900 ;
U.S. Cl.
CPC ...
B24B 4/900 ;
Abstract

The present invention provides an infrared spectroscopic method of removing a first layer from a semiconductor wafer without overpolishing the underlying second layer. The first layer and the second layer of the semiconductor wafer is subjected to infrared (IR) spectroscopy and an absorbance curve is produced, whereby each layer absorbs IR light at different wavenumbers to produce different absorbance peaks. Once the CMP process is performed, a change in the IR absorptivity and thus the absorbance peak of each layer is detected. The endpoint of the CMP process is determined at a point when significant change in the IR absorptivity of the first layer is no longer detected and change in the IR absorptivity of the second layer occurs.


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