The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2001
Filed:
Jul. 01, 1999
Applicant:
Inventors:
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/32 ; H05K 3/34 ; H01L 2/348 ; H01L 2/944 ;
U.S. Cl.
CPC ...
H05K 3/32 ; H05K 3/34 ; H01L 2/348 ; H01L 2/944 ;
Abstract
A device having a thin metallic coating, such as tin which forms strong bonds to copper is provided on the bond pads of an integrated circuit having copper metallization; surface oxidation of the coating is self limiting and the oxides are readily removed, further the coated bond pad forms intermetallics at low temperatures making it both solderable and compatible with wire bonding. A low cost process for forming tin coated copper bonding pads is provided by electroless plating.