The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2001
Filed:
Aug. 16, 1999
Applicant:
Inventors:
Peijun Ding, San Jose, CA (US);
Tony Chiang, Santa Clara, CA (US);
Tse-Yong Yao, San Francisco, CA (US);
Barry Chin, Saratoga, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 2/800 ; C25D 5/10 ; C25D 5/50 ; B05D 3/02 ; B05D 5/12 ;
U.S. Cl.
CPC ...
C23C 2/800 ; C25D 5/10 ; C25D 5/50 ; B05D 3/02 ; B05D 5/12 ;
Abstract
The invention generally provides a method for preparing a surface for electrochemical deposition comprising forming a high conductance barrier layer on the surface and depositing a seed layer over the high conductance barrier layer. Another aspect of the invention provides a method for filling a structure on a substrate, comprising depositing a high conductance barrier layer on one or more surfaces of the structure, depositing a seed layer over the barrier layer, and electrochemically depositing a metal to fill the structure.