The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2001

Filed:

Jan. 05, 2001
Applicant:
Inventors:

Ling-Hsu Tsang, Hsin-Chu, TW;

De-Yuan Wu, Hsin-Chu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/18242 ;
U.S. Cl.
CPC ...
H01L 2/18242 ;
Abstract

A method of fabricating a deep trench capacitor is achieved. A deep trench is formed in a silicon substrate followed by the formation of a buried plate in the silicon substrate beneath the deep trench. A silicon nitride layer is formed on the surface of the deep trench above the buried plate. An oxidation process is performed to simultaneously form a first oxide film on the silicon nitride layer and a second oxide film on the silicon substrate within the deep trench. A doped polysilicon layer is formed in the deep trench with its surface lowered down to the surface of the substrate. Finally, a portion of the second oxide film is removed to expose the substrate in the upper region of the deep trench followed by the filling in of an undoped polysilicon layer into the deep trench to finish the fabrication process of the DRAM deep trench capacitor.


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