The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2001
Filed:
Mar. 09, 2000
Applicant:
Inventors:
Takao Fujikawa, Takasago, JP;
Yutaka Narukawa, Takasago, JP;
Kohei Suzuki, Kobe, JP;
Takuya Masui, Kobe, JP;
Assignee:
Kabushiki Kaisha Kobe Seiko, Kobe, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1283 ;
U.S. Cl.
CPC ...
H01L 2/1283 ;
Abstract
A method of forming an intact wiring film by applying a filling treatment with a metal material with no pores to holes/trenches, the method comprising forming a barrier layer,to an insulation film,having holes/trenches,A, forming a seed layer by a PVD method on the surface of the barrier layer and laminating a wiring film,A by a electrolytic plating method and heat treating the same under a high temperature/high pressure gas atmosphere.