The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2001
Filed:
Dec. 20, 1999
Applicant:
Inventors:
Kumar Nagarajan, Fremont, CA (US);
Sarathy Rajagopalan, Fremont, CA (US);
Assignee:
LSI Logic Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/06 ;
U.S. Cl.
CPC ...
H05K 5/06 ;
Abstract
A packaging substrate includes a plurality of bonding pads and a plurality of gutters formed thereon. A die having conductive bumps on an electrically active surface thereof is positioned such that the conductive bumps of the die are electrically connected to the bonding pads of the packaging substrate. An underfill material fills the underfill space between the packaging substrate and the die to complete the structure. The plurality of gutters creates a linear flow front of the underfill material as it flows across the underfill space.