The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2001

Filed:

May. 24, 2000
Applicant:
Inventors:

Masatoshi Anma, Hyogo, JP;

Yoshinori Tanaka, Hyogo, JP;

Yoshifumi Takata, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/978 ;
U.S. Cl.
CPC ...
H01L 2/978 ;
Abstract

Sintering is effected a gate insulating film of a transistor in a hydrogen atmosphere at a temperature from 450° C. to 600° C. only before formation of an interconnection layer such as an aluminum interconnection layer which is less resistant to heat treatment at a temperature of 450° C. or more. Thereby, a method of manufacturing a semiconductor device can bring about sufficient recovery of a gate insulating film from process damages and others while preventing an adverse effect on the interconnection layer less resistant to the heat treatment at a high temperature.


Find Patent Forward Citations

Anma, Masatoshi. (2001). Method of manufacturing a semiconductor device (U.S. Patent No. 6319812). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6319812

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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