The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2001

Filed:

Aug. 18, 1999
Applicant:
Inventors:

Olivier Laparra, San Jose, CA (US);

Ramiro Solis, Andera, TX (US);

Hunter Brugge, San Antonio, TX (US);

Michela S. Love, San Antonio, TX (US);

Bijan Moslehi, Stanford, CA (US);

Milind Weling, San Jose, CA (US);

Assignee:

VLSI Technology, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/176 ;
U.S. Cl.
CPC ...
H01L 2/176 ;
Abstract

Disclosed are techniques to provide an integrated circuit, including the provision of improved integrated circuit isolation structures. The techniques include forming a number of trenches in an integrated circuit substrate to define a number of substrate regions that are to be electrically isolated from one another. A dielectric material is deposited in the trenches by exposure to a high density plasma having a first deposition-to-etch ratio. The high density plasma is adjusted to a second deposition-to-etch ratio greater than the first ratio to accumulate the dielectric material on the substrate after at least partially filling the trenches. A portion of the dielectric material is removed to planarize the workpiece. A number of components, such as insulated gate field effect transistors, may be subsequently formed in the substrate regions between the trenches.


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