The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2001
Filed:
Dec. 01, 1999
Philip S. Mauri, Laguna, PH;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A method of making an integrated circuit package is disclosed. A conductive first adhesive is applied onto a leadframe pad of a leadframe. A conductive second adhesive is applied on an input portion of the leadframe, such as a leadframe member that is integral with inner portions of input leadfingers. An integrated circuit die, such as a power MOSFET, is placed on the first adhesive on the leadframe pad. A conductive third adhesive is applied onto a surface of the integrated circuit die opposite the leadframe pad. A conductive strap is placed on the third adhesive on the integrated circuit die and on the second adhesive on the leadframe. The first, second and third adhesives are then simultaneously cured so that the integrated circuit die is permanently attached to the leadframe pad, and the conductive strap is permanently attached to the die and the leadframe member.