The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2001
Filed:
Sep. 15, 1999
Vaiyapuri Venkateshwaran, Singapore, SG;
Ji Cheng Yang, Singapore, SG;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
Multichip semiconductor assembly comprising a semiconductor chip stack comprising first and second chips, each having an active surface including an integrated circuit and a plurality of input/output contact pads, and a passive surface; a leadframe for interconnecting semiconductor integrated circuits having first and second surfaces, a plurality of leads, and a chip mount pad, said leadframe being disposed between said first and second chips, and at least a portion of said passive surface of said first chip being attached to said first surface of said chip mount pad; bonding wire connections between each of said contact pads of said first chip to said first surface of one of said leads, respectively; and solder ball connections between each of said contact pads of said second chip to said second surface of one of said leads, respectively, whereby the connections to at least one of said leads are common between said first and second chips.