The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2001
Filed:
Apr. 14, 1999
Liming Zhang, Sunnyvale, CA (US);
Milind Ganesh Weling, San Jose, CA (US);
VLSI Technology, Inc., San Jose, CA (US);
Abstract
A patterned polishing pad adapted for use in a wafer polishing machine. The patterned polishing pad has a polishing surface adapted to contact frictionally a semiconductor wafer being polished in a chemical mechanical polishing machine. The polishing surface has a first region and a second region. The first region is adapted to contact frictionally the wafer and achieve a first process effect. The second region is adapted to contact frictionally the wafer and achieve a second process effect. The surface of the second region extends a predetermined protrusion amount above the polishing surface with respect to the surface of the first region. In so doing, the wafer polishing machine achieves a customized process effect by moving the wafer frictionally against the first region with a down force operable for compressing the protrusion amount of the second region, and moving the wafer frictionally against the second region wherein the protrusion amount prevents the wafer from effectively contacting the first region.