The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2001

Filed:

May. 18, 1999
Applicant:
Inventors:

Byron Ciping Shen, Woodbury, MN (US);

Sumita B. Mitra, West St. Paul, MN (US);

Xiaodong Zhang, Woodbury, MN (US);

Robert D. Kuehn, Eagan, MN (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61C 5/04 ;
U.S. Cl.
CPC ...
A61C 5/04 ;
Abstract

Dental materials are provided comprising Component i), which is a hydrogen bondable compound that is a polymer having a molecular weight greater than about 10,000, and Component ii), which is a hydrogen bondable bridging compound. One of Components i) and ii) contains 2 or more hydrogen-bond donor sites per compound, and the other of Components i) or ii) contains 2 or more hydrogen-bond acceptor sites per compound, which hydrogen-bond acceptor sites are not capable of also acting as hydrogen-bond donor sites. Components i) and ii) are present in an amount sufficient to exhibit at least 10% higher Relative Viscosity, and optionally at least one of i) or ii) is polymerizable. If the material contains any compounds having only one hydrogen-bond donor site or hydrogen-bond acceptor site per compound, the ratio of hydrogen-bond donor sites on compounds having only one hydrogen-bond donor site to hydrogen-bond donor sites on compounds having 2 or more hydrogen-bond donor sites per compound is less than 0.25, and the ratio of hydrogen-bond acceptor sites on compounds having only one hydrogen-bond acceptor site to hydrogen-bond acceptor sites on compounds having 2 or more hydrogen-bond acceptor sites per compound is less than 0.25.


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