The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2001

Filed:

Aug. 03, 1995
Applicant:
Inventors:

Yang Pan, Singapore, SG;

Che-Chia Wei, Plano, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/128 ;
U.S. Cl.
CPC ...
H01L 2/128 ;
Abstract

A method for forming integrated circuit device structures upon active semiconductor regions of a semiconductor substrate. The active semiconductor regions are defined by Field OXide (FOX) isolation regions which are formed through a Polysilicon Buffered LOCal Oxidation of Silicon (PBLOCOS) oxidation mask structure. The PBLOCOS oxidation mask structure includes a blanket pad oxide layer which resides upon the semiconductor substrate, a blanket polysilicon buffer layer which resides upon the blanket pad oxide layer and a patterned silicon nitride layer which resides upon the blanket polysilicon buffer layer. Portions of the blanket polysilicon buffer layer and the blanket pad oxide layer exposed through the patterned silicon nitride layer are completely consumed to leave remaining the patterned silicon nitride layer, a patterned polysilicon buffer layer and a patterned pad oxide layer upon the active regions of the semiconductor substrate which are separated by the FOX isolation regions. The portions of the patterned silicon nitride layer, the patterned polysilicon buffer layer and the patterned pad oxide layer are employed in forming integrated circuit device structures upon the active semiconductor region of the semiconductor substrate.


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