The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2001
Filed:
May. 25, 2000
Yoshio Arimitsu, Kanuma, JP;
Yutaka Kaneda, Kanuma, JP;
Sony Chemicals Corporation, Tokyo, JP;
Abstract
A semiconductor element mounting interposer is produced by (A) forming a conducting circuit that comprises motherboard connecting electrodes,and plated leads,on an insulating base film,; (B) forming a patterning resin layer,over the conducting circuit,; (C) etching patterning resin layer,so as to expose the motherboard connecting electrodes,and plated leads,; (D) masking plated leads,with an electroplating resist layer,; (E) depositing an electroplated metal layer,over the exposed motherboard connecting electrodes,; (F) removing the electroplating resist layer,; (G) removing the exposed plated leads,through etching; and (H) where the patterning resin layer,is a polyimide precursor layer, bringing about complete imidation of the polyimide precursor layer.