The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2001
Filed:
Nov. 23, 1999
Applicant:
Inventors:
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23P 1/900 ;
U.S. Cl.
CPC ...
B23P 1/900 ;
Abstract
In a flip-chip bonding apparatus, a die inverting device is installed on an optical recognition device so that a vacuum suction chucking nozzle that is provided on the die inverting device can rotate in the direction of a pick-up position and in the direction of a die transfer position in an outside area of an open window of the optical recognition device, so that the bonding apparatus can be compact and has an improved precision of recognition of the amount of positional deviation of the die.