The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2001
Filed:
Aug. 31, 2000
Chunsheng Zhang, Chandler, AZ (US);
Jong-Kai Lin, Chandler, AZ (US);
Scott E. Lindsey, Mesa, AZ (US);
Yifan Guo, Gilbert, AZ (US);
Li Li, Gilbert, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method of manufacturing components includes providing a substrate (,) having a first coefficient of thermal expansion (CTE), having a first surface (,), and supporting a first plurality of interconnects located over the first surface in a first predetermined pattern. The method also includes providing another substrate (,) having a second CTE, having a second surface (,), and supporting a second plurality of interconnects located over the second surface in a second predetermined pattern. The method further includes assembling together the two substrates at a first temperature outside of a temperature range of approximately 25 to 30° C.