The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2001
Filed:
Feb. 22, 2000
Mehrdad Mahanpour, Union City, CA (US);
Jose Hulog, San Jose, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A method and system for removing a die from a semiconductor package is disclosed. The semiconductor package includes the die and a ceramic base. The die has a first face, a second face and a plurality of sides. The second face of the die is coupled with the ceramic base. The method and system include covering at least the first face and a portion of the plurality of sides of the die with a hard wax and encapsulating the hard wax and at least a first portion of the ceramic base in a resin. The method and system also include removing at least a second portion of the ceramic base to expose the second face of the die and removing the hard wax to free the die.