The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2001
Filed:
Nov. 21, 2000
Applicant:
Inventors:
Cuc K. Huynh, Jericho, VT (US);
Paul A. Manfredi, Waterbury Center, VT (US);
Thomas J. Martin, Franklin, VT (US);
Douglas P. Nadeau, Underhill, VT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1461 ;
U.S. Cl.
CPC ...
H01L 2/1461 ;
Abstract
Semiconductor materials are prepared by CMP with a first rough polishing step using an acidic slurry followed by cleaning a the pad and wafer separately. After cleaning a second polishing step with a basic slurry is used which buffs the wafer. Finally the pad and wafer are rinsed while a low pressure is applied to complete the process.
Huynh, Cuc. (2001). Method for chemical mechanical polishing of semiconductor wafer (U.S. Patent No. 6300246). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6300246
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile