Semiconductor device and process for producing the same

Abstract

A semiconductor device that meets the demand for realizing semiconductor chips in small sizes. A semiconductor device in which connection lands,formed on the electrode terminal carrying surface of a semiconductor chip,are electrically connected, through connection bumps,, to connection pads,formed on one surface of an interposing substrate,of an insulating material so as to face the connection lands,, wherein conductor wiring patterns,inclusive of the connection pads,are formed on one surface of the interposing substrate,, conductor wiring patterns,inclusive of terminal lands on where the external connection terminals,will be mounted, are formed on the other surface of the interposing substrate,, and the conductor wiring patterns,formed on one surface of the interposing substrate,are connected to the conductor wiring patterns,formed on the other surface of the interposing substrate,through vias,formed by filling recesses with a metal by plating, the recesses being formed to penetrate through the insulating material of the interposing substrate,and permitting the back surfaces of the conductor wiring patterns,on the side of the insulating material to be exposed on the bottom surfaces thereof.