The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2001

Filed:

Jul. 06, 2000
Applicant:
Inventors:

Yanjun Ma, Vancouver, WA (US);

Yoshi Ono, Camas, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/976 ; H01L 2/994 ; H01L 3/1062 ; H01L 3/1113 ; H01L 3/1119 ;
U.S. Cl.
CPC ...
H01L 2/976 ; H01L 2/994 ; H01L 3/1062 ; H01L 3/1113 ; H01L 3/1119 ;
Abstract

A high-k dielectric films is provided, which is doped with divalent or trivalent metals to vary the electron affinity, and consequently the electron and hole barrier height. The high-k dielectric film is a metal oxide of either zirconium (Zr) or hafnium (Hf), doped with a divalent metal, such as calcium (Ca) or strontium (Sr), or a trivalent metal, such as aluminum (Al), scandium (Sc), lanthanum (La), or yttrium (Y). By selecting either a divalent or trivalent doping metal, the electron affinity of the dielectric material can be controlled, while also providing a higher dielectric constant material then silicon dioxide. Preferably, the dielectric material will also be amorphous to reduce leakage caused by grain boundaries. Also provided are sputtering, CVD, Atomic Layer CVD, and evaporation deposition methods for the above-mentioned, doped high dielectric films.

Published as:
US6297539B1; KR20020005432A; JP2002033320A; EP1179837A2; TW519760B; EP1179837A3; JP3761419B2;

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