The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2001
Filed:
Apr. 11, 2000
Makoto Kitano, Tsuchiura, JP;
Ryuji Kohno, Ibaraki-ken, JP;
Naotaka Tanaka, Kodaira, JP;
Akihiro Yaguchi, Ibaraki-ken, JP;
Tetsuo Kumazawa, Ibaraki-ken, JP;
Ichiro Anjoh, Koganei, JP;
Hideki Tanaka, Sagamihara, JP;
Asao Nishimura, Kokubunji, JP;
Shuji Eguchi, Ibaraki-ken, JP;
Akira Nagai, Hitachi, JP;
Mamoru Mita, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.