The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2001
Filed:
Nov. 16, 1998
Erzhuang Liu, Singapore, SG;
Yang Pan, Singapore, SG;
Chartered Semiconductor Manufacturing Ltd., Singapore, SG;
Abstract
A new method of polishing very large diameter wafers. Multiple polishing pads are provided. Each polishing pad rotates around the Z-axis. Each pad can be individually controlled for Chemical Mechanical Planarization (CMP) process parameters such as pressure, rotation speed, slurry feed and slurry mixture. The planarization process can be controlled or optimized by individual rotating polishing pad or by a grouping of one or more rotating polishing pads. The wafer being processed can be rotated which further reduces the dependence on existing pad conditions which in turn translates into reduced use of slurry and prolonged life-time of the polishing pad.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile