The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2001
Filed:
Sep. 04, 1999
Applicant:
Inventor:
Robert B. Clark-Phelps, San Jose, CA (US);
Assignee:
Mitsubishi Materials Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B24B 4/900 ; B24B 5/100 ;
U.S. Cl.
CPC ...
B24B 4/900 ; B24B 5/100 ;
Abstract
A method and system for detecting a planarization endpoint of a semiconductor wafer planarization operation, which includes monitoring a motor current for at least one of a platen motor, a carousel motor and a head motor, performing a Fourier transform of the monitored current to identify periodic oscillations in the current, to ensure that undesirable oscillations in the monitored motor current are minimized, to provide better reliability and higher precision of end-point detection triggering.