The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2001
Filed:
Sep. 26, 2000
Noel M. Russell, Dallas, TX (US);
Anthony J. Konecni, Plano, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A system for constructing semiconductor devices is disclosed. The system comprises a wafer (,) having semiconductor devices (,), a bevel (,), an edge (,), a frontside (,), and a backside (,). The system also has a chamber (,), and a heater (,) coupled to the interior of the chamber (,) and operable to hold and heat the wafer (,). A showerhead (,) is also coupled to the interior of the chamber (,) and is operable to introduce a precursor gas (,) containing copper over the wafer (,). A shield (,) is coupled to the interior of the chamber (,) and is operable to partially shield the bevel (,), the edge (,), and the backside (,) of the wafer (,) from the precursor gas (,). There is an opening (,) in the chamber (,) through which a reactive backside gas (,) may be introduced under the wafer (,). A method for constructing semiconductor devices is disclosed. Step one calls for placing a wafer (,) on a heater (,) in a chamber (,). Step two requires heating the wafer with a heater (,). Step three provides for partially shielding the wafer (,) with a shield (,). In step four, the method provides for introducing a precursor gas (,) containing copper into the chamber (,) above the wafer (,). The last step calls for introducing a reactive backside gas (,) into the chamber (,) below the wafer (,) through an opening (,).