The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2001
Filed:
Mar. 24, 2000
Jyh-Ren Wu, Taipei, TW;
Chia-Chen Liu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A bonding pad structure and its method of manufacture. The structure has a metallic bonding pad with a patterned surface, a first passivation layer having an opening above the metallic bonding pad and a second passivation layer over the first passivation layer also having an opening above the metallic bonding pad. The method of forming the bonding pad structure includes forming a metallic bonding pad over a substrate, and then forming a first passivation layer over the substrate and the bonding pad. The first passivation layer above the bonding pad is patterned. Using the first passivation layer as a mask, a portion of the exposed metal pad material is removed. A patterned second passivation layer is formed over the first passivation layer. The second passivation layer has an opening that exposes the bonding pad. Finally, residual material from the first passivation layer inside the bonding pad region is removed to expose the bonding pad surface.