The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2001
Filed:
Sep. 01, 1999
Applicant:
Inventors:
Elke Zakel, Falkensee, DE;
Joachim Eldring, Phoenix, AZ (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 ; H01L 2/1283 ;
U.S. Cl.
CPC ...
H05K 1/18 ; H01L 2/1283 ;
Abstract
In a chip bonding method, first bonding bumps are applied to bonding electrodes of the chip, a first flexible circuit carrier is arranged on the chip, the flexible circuit carrier having cavities which are aligned with the bonding bumps, and second bonding bumps are applied to the first bonding bumps in such a way that bonding areas on the first flexible circuit carrier are in contact with the first and/or second bonding bumps.