The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2001
Filed:
Apr. 25, 2000
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A semiconductor device is provided which is capable of improving the productivity, the reliably, and the shielding of exposed parts such as leads or others and preventing chipping. The semiconductor device comprises a semiconductor chip,an insulating member,adhered onto an electrode terminal-forming surface,of a semiconductor chip,a circuit pattern,having at one end a land,to be connected to an external connection terminal, provided on the insulating member,and at the other end a lead,to be connected to an electrode terminal,a cover member,having an outer size larger than that of the semiconductor chip,to cover not only the electrode terminal-forming surface,and the lead,but also the outer edge of the semiconductor chip,and a resin shield,formed by filling a resinous sealant into a gap between the electrode terminal-forming surface,and the cover member,and curing the same, which shields the electrode terminal-forming surface,the lead,and a side surface of the semiconductor chip