The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2001
Filed:
Mar. 21, 2000
Kazunari Imai, Nagano, JP;
Shoji Watanabe, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A mounting structure is provided for mounting a semiconductor device having an electrode on a mounting substrate having a conductive pad. A metallic bump electrically connects the electrode of the semiconductor device to the conductive pad. A first eutectic solder is used for soldering between the metallic bump and the electrode of the semiconductor device. A second eutectic solder is used for soldering between the metallic bump and the conductive pad of the substrate. A melting point of the metallic bump is higher than those of the eutectic solders and a resistance to fatigue of the first eutectic solder is higher than that of the second eutectic solder. The first eutectic solder is composed of an Sn component of 63% by mass, a Pb component of 34.3% by mass, an In component of 1% by mass, an Sb component of 0.7% by mass, and an Ag component of 1% by mass.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile