The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2001

Filed:

Nov. 02, 1998
Applicant:
Inventors:

Edward G. Combs, Foster City, CA (US);

Robert Sheppard, Redbluff, CA (US);

Assignee:

ASAT, Limited, Tsuen Wan NT, HK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract

An integrated circuit package includes a ceramic ring having an inside cavity for accommodating a semiconductor die. Conductive traces are provided on the ceramic ring so as to serve as power and ground signal busses. Power and ground connection pads on the semiconductor die can be commonly bonded to these conductive traces, which are in turn commonly bonded to selected pins of the lead frame. In addition, an acrylic adhesive is used as a moisture-resistant adhesive.


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