The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2001
Filed:
Apr. 04, 1997
Applicant:
Inventors:
Takashi Yokoyama, Osaka, JP;
Kazuma Yamamoto, Osaka, JP;
Masato Yamamoto, Osaka, JP;
Takahiro Mishima, Osaka, JP;
Go Matsuda, Osaka, JP;
Shigeki Itou, Osaka, JP;
Assignee:
Daido Hoxan Inc., Sapporo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B28D 5/00 ; C30B 3/312 ;
U.S. Cl.
CPC ...
B28D 5/00 ; C30B 3/312 ;
Abstract
A method and an apparatus for cutting a wafer from a crystalline ingot, by directing a stream or streams of etching gas at the crystalline ingot in a vacuum. Waste in cutting can be greatly minimized and the work environment can also be kept clean. Further, excellent surface smoothness can be realized on the cut wafers.