The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2001
Filed:
Jul. 01, 1999
Applicant:
Inventors:
Yinon Degani, Highland Park, NJ (US);
Thomas Dixon Dudderar, Chatham, NJ (US);
Robert Charles Frye, Piscataway, NJ (US);
Assignee:
Agere Systems Guardian Corp., Orlando, FL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 ;
U.S. Cl.
CPC ...
H05K 1/18 ;
Abstract
The specification describes a high density I/O IC package in which the IC chip is bonded to a silicon intermediate interconnection substrate (IIS), and the IIS is wire bonded to a printed wiring board. This marriage of wire bond technology with high density I/O IC chips results in a low cost, high reliability, state of the art IC package.