Integration of heat conducting apparatus and chip carrier in ic package

Abstract

The present invention suggests a new scheme of integrating a heat conducting promotion apparatus (or heat sink) and a chip carrier (such as a substrate) of an IC package including a chip. It is characterized by at least a cavity which is in the chip carrier and around the chip, and the configuration of the heat conducting promotion apparatus having a first part which is close to or contacts a heat conducting surface of the chip, and a second part which extends from the first part toward the cavity until it partly contacts a surface of the chip carrier and partly is inside of the cavity. It is also characterized by options of placing at least an elastic entity in the cavity to contact the heat conducting promotion apparatus' part which is inside the cavity, or twisting the heat conducting promotion apparatus' part which is inside the cavity. Such schemes immunize an IC package against the warpage of heat conducting promotion apparatus resulting from the thermal stress suffered by the chip in the IC package, thereby the adaptability of the IC package to environment and the quality reliability of the IC package can be significantly promoted.