The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2001

Filed:

Jan. 26, 1999
Applicant:
Inventors:

Song Sheng Xue, Edina, MN (US);

Bogdan Marius Simion, Pleasanton, CA (US);

James Frank Dolejsi, Chanhassen, MN (US);

Patrick Joseph Ryan, St. Paul, MN (US);

Assignee:

Seagate Technology LLC, Scotts Valley, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11B 5/39 ; G11B 5/127 ; G11B 5/33 ;
U.S. Cl.
CPC ...
G11B 5/39 ; G11B 5/127 ; G11B 5/33 ;
Abstract

The present invention is a magnetoresistive (MR) sensor that combines a hard-biasing material with an underlayer of cubic-titanium-tungsten to improve the stability of the MR sensor. The permanency of the hard-biasing material affects both the transverse and longitudinal biasing of the MR sensor, which in turn affects the stability of the MR sensor. The stability of the hard-biasing material is improved by combining it with an underlayer of cubic-titanium-tungsten. The underlayer enhances the hard-biasing material by improving the longitudinal magnetic anisotropy, the coercivity, and the in-plane squareness of the hard-biasing material. The combination of hard-biasing material and cubic-titanium-tungsten underlayer can be used in a variety of MR sensor embodiments, specifically an abutted junction or an overlaid structure. The method of making the abutted junction or overlaid structures is also improved by using cubic-titanium-tungsten as the underlayer of the hard-biasing material. The cubic-titanium-tungsten underlayer can be deposited at temperatures which are normal for the manufacturing of MR sensors, thus extra process steps are not needed. In addition, the process is more consistent and reliable.


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